Ingolise ho Mecha ea rona ea Sechaba bakeng sa Post e Potlakileng
Kenyelletso ea Ts'ebetso ea Laser ho Tlhahiso
Theknoloji ea ts'ebetso ea laser e bile le nts'etsopele e potlakileng 'me e sebelisoa haholo mafapheng a fapaneng, joalo ka sefofane, likoloi, lisebelisoa tsa elektroniki le tse ling. E bapala karolo ea bohlokoa ho ntlafatseng boleng ba sehlahisoa, tlhahiso ea basebetsi, le boiketsetso, ha e ntse e fokotsa tšilafalo le tšebeliso ea thepa (Gong, 2012).
Ts'ebetso ea Laser ka Lisebelisoa tsa Metal le tse seng tsa tšepe
Tšebeliso ea mantlha ea ho sebetsa ka laser lilemong tse leshome tse fetileng e bile lisebelisoa tsa tšepe, ho kenyelletsa ho seha, ho cheselletsa le ho roala. Leha ho le joalo, tšimo e ntse e hola ho ba lisebelisoa tseo e seng tsa tšepe tse kang masela, likhalase, lipolasetiki, li-polymers le lirafshoa. E 'ngoe le e' ngoe ea lisebelisoa tsena e bula menyetla ea liindasteri tse fapa-fapaneng, le hoja e se e thehile mekhoa ea ho sebetsa (Yumoto et al., 2017).
Liqholotso le Litlhahiso ho Phetoho ea Khalase ea Laser
Glass, ka ts'ebeliso ea eona e batsi liindastering tse kang tsa likoloi, tsa kaho le tsa elektroniki, e emetse sebaka sa bohlokoa bakeng sa ts'ebetso ea laser. Mekhoa e tloaelehileng ea ho itšeha likhalase, e kenyelletsang lisebelisoa tse thata tsa alloy kapa daemane, e lekanyelitsoe ke ts'ebetso e tlase le methati e thata. Ka lehlakoreng le leng, laser cutting e fana ka mokhoa o mong o sebetsang hantle le o nepahetseng. Sena se bonahala haholo liindastering tse kang tlhahiso ea li-smartphone, moo ho itšeha ka laser ho sebelisetsoang likoahelo tsa lense tsa khamera le li-skrini tse kholo (Ding et al., 2019).
Ts'ebetso ea Laser ea Mefuta ea Khalase ea Boleng bo Phahameng
Mefuta e fapaneng ea likhalase, joalo ka khalase ea optical, khalase ea quartz, le khalase ea safire, e hlahisa liphephetso tse ikhethang ka lebaka la sebopeho sa tsona se brittle. Leha ho le joalo, mekhoa e tsoetseng pele ea laser e kang femtosecond laser etching e nolofalelitse ts'ebetso e nepahetseng ea lisebelisoa tsena (Sun & Flores, 2010).
Tšusumetso ea Wavelength ho Mekhoa ea Theknoloji ea Laser
Bophahamo ba laser bo ama ts'ebetso haholo, haholo bakeng sa lisebelisoa tse kang tšepe ea sebopeho. Li-laser tse tsoang libakeng tsa ultraviolet, tse bonahalang, tse haufi le tse hole tsa infrared li hlahlobiloe bakeng sa matla a tsona a bohlokoa bakeng sa ho qhibiliha le ho fetoha mouoane (Lazov, Angelov, & Teirumnieks, 2019).
Lisebelisoa tse fapaneng tse thehiloeng ho Wavelengths
Khetho ea laser wavelength ha e na boikhethelo empa e itšetlehile haholo ka thepa ea thepa le sephetho se lakatsehang. Mohlala, li-lasers tsa UV (tse nang le maqhubu a makhutšoane) li ntle haholo bakeng sa ho betla ka nepo le ho etsa micromachining, kaha li ka hlahisa lintlha tse ntle. Sena se etsa hore e be tse loketseng indastering ea semiconductor le microelectronics. Ka lehlakoreng le leng, li-lasers tsa infrared li sebetsa hantle haholo bakeng sa ts'ebetso ea thepa e teteaneng ka lebaka la bokhoni ba tsona ba ho kenella ka botebo, e leng se etsang hore li tšoanelehe bakeng sa lits'ebetso tse boima tsa indasteri. (Majumdar & Manna, 2013) Ka mokhoa o ts'oanang, li-lasers tse tala, tse atisang ho sebetsa ka leqhubu la 532 nm, li fumana sebaka sa tsona sa lits'ebetso tse hlokang ho nepahala ho phahameng ho nang le tšusumetso e fokolang ea mocheso. Li sebetsa hantle haholo ho li-microelectronics bakeng sa mesebetsi e kang mokhoa oa potoloho, lits'ebetsong tsa bongaka bakeng sa lits'ebetso tse joalo ka photocoagulation, le lekaleng la matla a ka nchafalitsoeng bakeng sa tlhahiso ea lisele tsa letsatsi. Leqhubu le ikhethang la li-laser tse tala le tsona li li etsa hore li tšoanelehe bakeng sa ho tšoaea le ho betla lisebelisoa tse fapaneng, ho kenyeletsoa lipolasetiki le litšepe, moo ho batloang phapang e phahameng le tšenyo e fokolang ea bokaholimo. Ho ikamahanya le maemo ha li-lasers tse tala ho hatisa bohlokoa ba khetho ea maqhubu ho theknoloji ea laser, ho netefatsa hore ho na le liphello tse ntle bakeng sa lisebelisoa tse khethehileng le lisebelisoa.
Thelaser e tala ea 525nmke mofuta o ikhethileng oa theknoloji ea laser e khetholloang ka khanya ea eona e tala e ikhethang ka bolelele ba li-nanometers tse 525. Li-laser tse tala sebakeng sena sa wavelength li fumana lits'ebetso ho retinal photocoagulation, moo matla a tsona a phahameng le ho nepahala ho leng molemo. Li boetse li na le thuso ts'ebetsong ea thepa, haholo-holo masimong a hlokang ts'ebetso e nepahetseng le e fokolang ea mocheso.Nts'etsopele ea li-laser diode tse tala ka sefofaneng sa c-plane GaN substrate ho ea bolelele ba maqhubu a malelele ho 524-532 nm e tšoaea tsoelo-pele e kholo ho theknoloji ea laser. Nts'etsopele ena e bohlokoa bakeng sa lits'ebetso tse hlokang litšobotsi tse ikhethang tsa wavelength
Tsoelang Pele Wave le Modelocked Laser Mehloli
Continuous wave (CW) le modelocked quasi-CW laser sources at various wavelengths like near-infrared (NIR) at 1064 nm, green at 532 nm, and ultraviolet (UV) at 355 nm li nkoa e le laser doping selective emitter cell cell. Maqhubu a fapaneng a na le litlamorao bakeng sa ho ikamahanya le maemo le katleho (Patel et al., 2011).
Excimer Lasers bakeng sa Wide Band Gap Materials
Li-laser tsa Excimer, tse sebetsang ka bolelele ba maqhubu a UV, li loketse ho sebetsana le lisebelisoa tse nang le li-bandgap tse pharaletseng joalo ka khalase le carbon fiber-reinforced polymer (CFRP), tse fanang ka ts'ebetso e nepahetseng le e fokolang ea mocheso (Kobayashi et al., 2017).
Nd: LAG Lasers bakeng sa Likopo tsa Indasteri
Li-lasers tsa Nd:YAG, ka ho ikamahanya le maemo ho latela mokhoa oa ho tsamaisa maqhubu, li sebelisoa mefuteng e mengata ea lits'ebetso. Bokhoni ba bona ba ho sebetsa ho 1064 nm le 532 nm bo lumella ho fetoha ha maemo ha ho sebetsa lisebelisoa tse fapaneng. Mohlala, bolelele ba maqhubu a 1064 nm bo loketse bakeng sa ho taka ka botebo holim'a litšepe, ha 532 nm wavelength e fana ka mongolo oa boleng bo holimo holim'a lipolasetiki le litšepe tse koahetsoeng. (Moon et al., 1999).
→Lihlahisoa tse Amanang:CW Diode-pumped solid-state laser e nang le wavelength ea 1064nm
Matla a Phahameng a Matla a Fiber Laser Welding
Li-laser tse nang le wavelengths tse haufi le 1000 nm, tse nang le boleng bo botle ba boleng le matla a phahameng, li sebelisoa ho keyhole laser welding bakeng sa tšepe. Li-laser tsena li etsa mouoane ka mokhoa o atlehileng le ho qhibilihisa lisebelisoa, li hlahisa li-welds tsa boleng bo holimo (Salminen, Piili, & Purtonen, 2010).
Ho kopanngoa ha Laser Processing le mekhoa e meng ea theknoloji
Ho kopanngoa ha laser processing le mahlale a mang a tlhahiso, joalo ka ho roala le ho sila, ho lebisitse lits'ebetsong tse sebetsang hantle le tse fapaneng tsa tlhahiso. Ho kopanya hona ho molemo ka ho khetheha liindastering tse kang ho etsa lisebelisoa le ho shoa le ho lokisa enjene (Nowotny et al., 2010).
Ts'ebetso ea Laser Libakeng Tse Tsoang
Ts'ebeliso ea theknoloji ea laser e fetela masimong a ntseng a hlaha joalo ka liindasteri tsa semiconductor, lipontšo, le liindasteri tse tšesaane tsa lifilimi, tse fanang ka bokhoni bo bocha le ho ntlafatsa thepa ea thepa, ho nepahala ha sehlahisoa, le ts'ebetso ea sesebelisoa (Hwang et al., 2022).
Mekhoa ea Bokamoso ea Ts'ebetso ea Laser
Lintlafatso tsa nako e tlang tsa thekenoloji ea ts'ebetso ea laser li tsepamisitse maikutlo mekhoeng e mecha ea ho qapa, ho ntlafatsa litšoaneleho tsa sehlahisoa, boenjiniere bo kopantsoeng ba likarolo tse ngata tsa thepa le ho ntlafatsa melemo ea moruo le ea tsamaiso. Sena se kenyelletsa tlhahiso e potlakileng ea laser ea meaho e nang le porosity e laoloang, welding e nyalisitsoeng, le laser profile seha ea maqephe a tšepe (Kukreja et al., 2013).
Theknoloji ea ts'ebetso ea laser, ka lits'ebetso tsa eona tse fapaneng le lits'ebetso tse tsoelang pele, e theha bokamoso ba tlhahiso le ts'ebetso ea thepa. Ho feto-fetoha ha eona le ho nepahala ha eona ho etsa hore e be sesebelisoa sa bohlokoa liindastering tse fapa-fapaneng, ho sutumelletsa meeli ea mekhoa e tloaelehileng ea tlhahiso.
Lazov, L., Angelov, N., & Teirumnieks, E. (2019). MOKHOA BAKENG SA Khakanyo ea PELE EA BOHLOKOA BOHLOKOA MATLA A TSAMAISO EA LASER THEKNOLOJIA.TIKOLOHO. TS'OANELO MATS'OANE. MOSEBETSI. Melaetsa ea Seboka sa Machaba sa Saense le Sebetsa. Sehokelo
Patel, R., Wenham, S., Tjahjono, B., Hallam, B., Sugianto, A., & Bovatsek, J. (2011). Ho etsoa ka lebelo le phahameng la Laser Doping Selection Emitter Solar Cells Ho Sebelisa 532nm Continuous Wave (CW) le Modelocked Quasi-CW Laser Sources.Sehokelo
Kobayashi, M., Kakizaki, K., Oizumi, H., Mimura, T., Fujimoto, J., & Mizoguchi, H. (2017). DUV matla a phahameng a lasers a sebetsa bakeng sa khalase le CFRP.Sehokelo
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Salminen, A., Piili, H., & Purtonen, T. (2010). Litšobotsi tsa matla a phahameng a fiber laser welding.Melaetsa ea Setheo sa Baenjiniere ba Mechini, Karolo ea C: Journal of Mechanical Engineering Science, 224, 1019-1029.Sehokelo
Majumdar, J., & Manna, I. (2013). Selelekela ho Laser Thuso ea Thepa ea Lisebelisoa.Sehokelo
Gong, S. (2012). Patlisiso le ts'ebeliso ea theknoloji e tsoetseng pele ea ts'ebetso ea laser.Sehokelo
Yumoto, J., Torizuka, K., & Kuroda, R. (2017). Nts'etsopele ea Bethe ea Teko ea Tlhahiso ea Laser le Database bakeng sa Ts'ebetso ea Laser-Material.Tlhahlobo ea Boenjiniere ba Laser, 45, 565-570.Sehokelo
Ding, Y., Xue, Y., Pang, J., Yang, L.-j., & Hong, M. (2019). Tsoelo-pele ho thekenoloji ea ho shebella in-situ bakeng sa ts'ebetso ea laser.SCIENTIA SINICA Physica, Mechanica & Astronomica. Sehokelo
Sun, H., & Flores, K. (2010). Microstructural Analysis of a Laser-Processed Bulk Metallic Glass ea Zr-based.Metallurgical and Materials Transactions A. Sehokelo
Nowotny, S., Muenster, R., Scharek, S., & Beyer, E. (2010). Sele ea laser e kopantsoeng bakeng sa ho koaheloa ka laser le ho sila.Assembly Automation, 30(1), 36-38.Sehokelo
Kukreja, LM, Kaul, R., Paul, C., Ganesh, P., & Rao, BT (2013). Mekhoa e Hlahang ea Lisebelisoa tsa Laser bakeng sa Likopo tsa Liindasteri tsa Kamoso.Sehokelo
Hwang, E., Choi, J., & Hong, S. (2022). Mekhoa e ntseng e tsoela pele ea laser-assisted vacuum bakeng sa tlhahiso ea boleng bo holimo, e fanang ka lihlahisoa tse ngata.Nanoscale. Sehokelo
Nako ea poso: Jan-18-2024