Lisebelisoa tsa Solder bakeng sa Laser Diode Bars: Borokho Bo Bohlokoa Pakeng Tsa Ts'ebetso le Tšepahala.

Moralong le tlhahisong ea li-laser tsa semiconductor tsa matla a holimo, li-laser diode bar li sebetsa e le li-unit tsa mantlha tse ntšang mabone. Ts'ebetso ea bona ha e itšetlehe feela ka boleng ba kahare ba li-chips tsa laser empa hape le haholo ts'ebetsong ea ho paka. Har'a likarolo tse fapaneng tse kenyellelitsoeng ho paka, lisebelisoa tsa solder li phetha karolo ea bohlokoa e le sebopeho sa mocheso le motlakase pakeng tsa chip le sink ea mocheso.

巴条激光器的封装焊料

1. Karolo ea Solder ka Laser Diode Bars

Li-bar diode tsa laser hangata li kopanya li-emitter tse ngata, e leng se bakang khatello e phahameng ea matla le litlhoko tse thata tsa taolo ea mocheso. Ho finyella mocheso o sebetsang hantle le botsitso ba sebopeho, lisebelisoa tsa solder li tlameha ho finyella litekanyetso tse latelang:

① Thermal conductivity e phahameng:

E netefatsa phetisetso e nepahetseng ea mocheso ho tsoa ho chip ea laser.

② Ho ba metsi hantle:

E fana ka maqhama a tiileng pakeng tsa chip le substrate.

③ Sebaka se nepahetseng sa ho qhibiliha:

E thibela ho phalla kapa ho senyeha nakong ea ts'ebetso kapa ts'ebetso e latelang.

④ Coefficient e lumellanang ea katoloso ea mocheso (CTE):

E fokotsa khatello ea mocheso ho chip.

⑤ Khanyetso e ntle ea mokhathala:

E lelefatsa bophelo ba ts'ebeletso ea sesebelisoa.

2. Mefuta e Tloaelehileng ea Solder bakeng sa Packaging ea Laser Bar

Tse latelang ke mefuta e meraro ea mantlha ea lisebelisoa tsa solder tse atisang ho sebelisoa ho paka li-bar diode tsa laser:

Khauta-Tin Alloy (AuSn)

Thepa:

Sebopeho sa Eutectic sa 80Au/20Sn se nang le ntlha ea ho qhibiliha ea 280 ° C; conductivity e phahameng ea mocheso le matla a mochine.

Melemo:

Botsitso bo botle ba mocheso o phahameng, bophelo bo bolelele ba mokhathala, bo se nang tšilafalo ea lintho tse phelang, ts'epo e phahameng.

Lisebelisoa:

Litsamaiso tsa laser tsa sesole, tsa sefofane, le tsa maemo a holimo tsa indasteri.

Pure Indian (In)

Thepa:

Sebaka se qhibilihang sa 157 ° C; e bonolo ebile e bonolo haholo.

Melemo:

Ts'ebetso e phahameng ea libaesekele tse futhumatsang, khatello e tlase ho chip, e loketseng ho sireletsa meaho e senyehang, e loketseng litlhoko tsa maqhama a mocheso o tlase.

Meeli:

E tloaetse ho oxidation; e hloka sepakapaka sa inert nakong ea ts'ebetso, matla a tlase a mochini; ha e loketse lits'ebetso tse ngata haholo

Composite Solder Systems (mohlala, AuSn + In)

Sebopeho:

Ka tloaelo, AuSn e sebelisoa ka tlas'a chip bakeng sa sehokelo se matla, ha In e sebelisoa ka holimo bakeng sa buffering e ntlafalitsoeng ea mocheso.

Melemo:

E kopanya ts'epo e phahameng le ho imolla khatello ea maikutlo, e ntlafatsa ho tšoarella ha liphutheloana ka kakaretso, e ikamahanya hantle le maemo a fapaneng a ts'ebetso.

3. Tšusumetso ea Boleng ba Solder ho Ts'ebetso ea Sesebelisoa

Khetho ea thepa ea solder le taolo ea ts'ebetso e ama haholo ts'ebetso ea electro-optical le botsitso ba nako e telele ba lisebelisoa tsa laser:

Ntho ea Solder

Tšusumetso ho Sesebediswa

Ho tšoana ha lera la solder

E ama kabo ea mocheso le ho lumellana ha matla a optical

Void ratio

Li-voids tse phahameng li etsa hore ho be le khanyetso e eketsehileng ea mocheso le ho futhumala ha libaka

Bohloeki ba motsoako

E susumetsa botsitso ba ho qhibiliha le ho hasana ha intermetallic

Ho koloba ha sefahleho

E khetha matla a bonding le interface ea mocheso oa mocheso

Tlas'a ts'ebetso e tsoelang pele ea matla a phahameng, esita le mefokolo e nyane ea solder e ka lebisa ho hahelletsoeng ka mocheso, ho fella ka ho senyeha ha ts'ebetso kapa ho hloleha ha sesebelisoa. Ka hona, ho khetha solder ea boleng bo holimo le ho kenya ts'ebetsong mekhoa e nepahetseng ea solder ke tsa bohlokoa ho finyella liphutheloana tsa laser tse tšepahalang haholo.

4. Mekhoa ea Bokamoso le Tsoelo-pele

Ha mahlale a laser a ntse a tsoela pele ho kenella ts'ebetsong ea indasteri, opereishene ea bongaka, LiDAR, le likarolo tse ling, lisebelisoa tsa solder bakeng sa liphutheloana tsa laser li fetoha ka litsela tse latelang:

Thekiso ea mocheso o tlase:

Bakeng sa ho kopanngoa le lisebelisoa tsa mocheso oa mocheso

Solder e se nang loto:

Ho kopana le RoHS le melaoana e meng ea tikoloho

Lisebelisoa tse phahameng tsa tšebetso ea thermal interface (TIM):

Ho tsoela pele ho fokotsa ho hanyetsa mocheso

Litheknoloji tsa ho kopanya li-micro-soldering:

Ho ts'ehetsa miniaturization le khokahano e phahameng haholo

5. Qetello

Leha e le nyane ka bongata, lisebelisoa tsa solder ke lihokelo tsa bohlokoa tse netefatsang ts'ebetso le ts'epahalo ea lisebelisoa tsa laser tse matla haholo. Ka har'a sephutheloana sa li-bar diode tsa laser, ho khetha solder e nepahetseng le ho ntlafatsa ts'ebetso ea bonding ho bohlokoa ho fihlela ts'ebetso e tsitsitseng ea nako e telele.

6. Mabapi le Rona

Lumispot e ikemiselitse ho fa bareki likarolo tsa laser tse hloahloa le tse tšepahalang le litharollo tsa ho paka. Ka boiphihlelo bo batsi mabapi le khetho ea thepa ea solder, moralo oa taolo ea mocheso, le tlhahlobo ea ts'epahalo, re lumela hore ntlafatso e 'ngoe le e 'ngoe ka botlalo e bula tsela ea bokhabane. Bakeng sa tlhaiso-leseling e batsi ka theknoloji ea ho paka ka laser ea matla a holimo, ikutloe u lokolohile ho ikopanya le rona.


Nako ea poso: Jul-07-2025